JPH0369248B2 - - Google Patents

Info

Publication number
JPH0369248B2
JPH0369248B2 JP61048624A JP4862486A JPH0369248B2 JP H0369248 B2 JPH0369248 B2 JP H0369248B2 JP 61048624 A JP61048624 A JP 61048624A JP 4862486 A JP4862486 A JP 4862486A JP H0369248 B2 JPH0369248 B2 JP H0369248B2
Authority
JP
Japan
Prior art keywords
pressing body
cord
ratchet
wall
reel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP61048624A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62208213A (ja
Inventor
Keizo Oota
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NIIMYA SHOKO KK
Original Assignee
NIIMYA SHOKO KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NIIMYA SHOKO KK filed Critical NIIMYA SHOKO KK
Priority to JP61048624A priority Critical patent/JPS62208213A/ja
Priority to EP86401092A priority patent/EP0203011B1/en
Priority to US06/866,503 priority patent/US4672798A/en
Priority to AU57870/86A priority patent/AU578004B2/en
Publication of JPS62208213A publication Critical patent/JPS62208213A/ja
Publication of JPH0369248B2 publication Critical patent/JPH0369248B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Harvester Elements (AREA)
JP61048624A 1985-05-24 1986-03-07 刈払機のコ−ド繰出し装置 Granted JPS62208213A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP61048624A JPS62208213A (ja) 1986-03-07 1986-03-07 刈払機のコ−ド繰出し装置
EP86401092A EP0203011B1 (en) 1985-05-24 1986-05-23 Apparatus for cutting grass
US06/866,503 US4672798A (en) 1985-05-24 1986-05-23 Apparatus for cutting grass
AU57870/86A AU578004B2 (en) 1985-05-24 1986-05-23 Apparatus for cutting grass

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61048624A JPS62208213A (ja) 1986-03-07 1986-03-07 刈払機のコ−ド繰出し装置

Publications (2)

Publication Number Publication Date
JPS62208213A JPS62208213A (ja) 1987-09-12
JPH0369248B2 true JPH0369248B2 (en]) 1991-10-31

Family

ID=12808556

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61048624A Granted JPS62208213A (ja) 1985-05-24 1986-03-07 刈払機のコ−ド繰出し装置

Country Status (1)

Country Link
JP (1) JPS62208213A (en])

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7057280B2 (en) 1998-11-20 2006-06-06 Amkor Technology, Inc. Leadframe having lead locks to secure leads to encapsulant
US7192807B1 (en) 2002-11-08 2007-03-20 Amkor Technology, Inc. Wafer level package and fabrication method
US7361533B1 (en) 2002-11-08 2008-04-22 Amkor Technology, Inc. Stacked embedded leadframe
US7572681B1 (en) 2005-12-08 2009-08-11 Amkor Technology, Inc. Embedded electronic component package
US8900995B1 (en) 2010-10-05 2014-12-02 Amkor Technology, Inc. Semiconductor device and manufacturing method thereof
US8937381B1 (en) 2009-12-03 2015-01-20 Amkor Technology, Inc. Thin stackable package and method
US8981572B1 (en) 2011-11-29 2015-03-17 Amkor Technology, Inc. Conductive pad on protruding through electrode semiconductor device
US9048298B1 (en) 2012-03-29 2015-06-02 Amkor Technology, Inc. Backside warpage control structure and fabrication method
US9082833B1 (en) 2011-01-06 2015-07-14 Amkor Technology, Inc. Through via recessed reveal structure and method
US9129943B1 (en) 2012-03-29 2015-09-08 Amkor Technology, Inc. Embedded component package and fabrication method

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5020223A (en) * 1989-11-02 1991-06-04 White Consolidated Industries, Inc. Simplified bump-feed type cutting head assembly for flexible line trimmers

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6033788U (ja) * 1983-08-15 1985-03-07 株式会社東芝 電磁調理器
JPS6115930U (ja) * 1985-06-20 1986-01-30 小松ゼノア株式会社 刈払機

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7057280B2 (en) 1998-11-20 2006-06-06 Amkor Technology, Inc. Leadframe having lead locks to secure leads to encapsulant
US9054117B1 (en) 2002-11-08 2015-06-09 Amkor Technology, Inc. Wafer level package and fabrication method
US7192807B1 (en) 2002-11-08 2007-03-20 Amkor Technology, Inc. Wafer level package and fabrication method
US7247523B1 (en) 2002-11-08 2007-07-24 Amkor Technology, Inc. Two-sided wafer escape package
US7361533B1 (en) 2002-11-08 2008-04-22 Amkor Technology, Inc. Stacked embedded leadframe
US7420272B1 (en) 2002-11-08 2008-09-02 Amkor Technology, Inc. Two-sided wafer escape package
US8952522B1 (en) 2002-11-08 2015-02-10 Amkor Technology, Inc. Wafer level package and fabrication method
US7572681B1 (en) 2005-12-08 2009-08-11 Amkor Technology, Inc. Embedded electronic component package
US8937381B1 (en) 2009-12-03 2015-01-20 Amkor Technology, Inc. Thin stackable package and method
US8900995B1 (en) 2010-10-05 2014-12-02 Amkor Technology, Inc. Semiconductor device and manufacturing method thereof
US9082833B1 (en) 2011-01-06 2015-07-14 Amkor Technology, Inc. Through via recessed reveal structure and method
US8981572B1 (en) 2011-11-29 2015-03-17 Amkor Technology, Inc. Conductive pad on protruding through electrode semiconductor device
US9048298B1 (en) 2012-03-29 2015-06-02 Amkor Technology, Inc. Backside warpage control structure and fabrication method
US9129943B1 (en) 2012-03-29 2015-09-08 Amkor Technology, Inc. Embedded component package and fabrication method

Also Published As

Publication number Publication date
JPS62208213A (ja) 1987-09-12

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